Ion-trapping AgentsIon-trapping Agent IXEPLAS®
IXEPLAS is an even higher-performance version of IXE®, our ion-trapping agent with superior ion-trapping capacity and heat resistance properties. In addition to increasing the reliability of sealing materials, it can also be used for advanced semiconductor packages which have been incompatible until now.
Characteristics
- Its primary particle size is sub-micron, and it can be used for underfill materials, narrow pitch sealants, and more.
- The fine particle size means that small quantities of the additive are highly effective.
- Has a copper and silver ion-trapping effect, making it ideal for copper bonding wire, sealing silver wiring, and more.
- Shows ion-trapping capability at a broad pH range because it is a dual ion exchanger.
- With minimal impurities, it has almost no negative effects on sealing materials.
- Contains no substances subject to the Restriction of Hazardous Substances (RoHS) Directive.
Mechanism of IXE®/IXEPLAS
Comparison between IXEPLAS and IXE®
- IXEPLAS’ fine particle size makes it effective with smaller quantities of additive.
Conventional IXE® (1 to 2 μm)
It captures some, but not all, free Cl- ions.
IXEPLAS (0.2 to 0.5 μm)
With even a small amount of additive, free Cl- ions are reliably captured.
- IC sealing material (EMC, liquid sealing material, underfill material, and die bonding)
- FPC Adhesives
- Solar battery materials and components (back sheet, sealing resin)
- Resist inks
- Conductive pastes, etc.