Functional AdhesivesFilm adhesives

Features

Hot melt adhesive films

ARON MELT® PES Series

ARON MELT® PES is a series of thermoplastic polyester adhesives. The series offers superior adhesion to plastics such as PET, PC, and PVC as well as metals such as copper and aluminum. Due to their excellent solvent resistance and electrical characteristics, these products can be used in laminate adhesives for FFC and IC cards, as well as in sealant materials.

1. Excellent adhesion to metals and plastics including PET, PC, ABS and PVC.
2. Excellent electrical characteristics including voltage resistance and high insulation characteristics.
3. The crystal type has excellent solvent resistance.

ARON MELT® PPET Series (New product)

ARON MELT® PPET-1200 is a series of heat resistant hot melt adhesives developed for the lamination and bonding of different materials, such as metal with plastic. Products are available as pellets and films.

1. Excellent adhesion to plastics including, PP, PE and PET, as well as metals such as aluminum and copper.
2. Features low hygroscopicity and excellent chemical resistance to acids, alkalis and alcohols.
3. It can achieve adhesion within a short time as the nature of hot melt adhesives.
4. Provides good working environment as no organic solvent is contained.

Low dielectric bonding film (New product)

1. Film type modified epoxy adhesive.
2. Excellent dielectric properties (Dk = 2.2, Df = 0.002).
3. Excellent adhesion to substrates such as polyimide, LCP (liquid crystal polymer), and copper foil.
4. Excellent solder dip resistance.

Application example

Hot melt adhesive film PES Series

Excellent adhesion to plastics such as PET, polycarbonate and vinyl chloride, and metals such as copper and aluminum. It can be used in laminate adhesives for FFC and IC cards, as well as in sealant materials.

Hot melt adhesive film PPET Series

Excellent adhesion to plastics such as PP, PE and PET and metals such as copper and aluminum. It can be applied to laminating and bonding different types of material.

Low dielectric bonding film

Exhibits excellent adhesiveness to substrates such as polyimide, LCP (liquid crystal polymer), and copper foil. It has excellent dielectric properties and can suppress signal loss in large volume high-speed communication.